AMBIENT TEMPERATURE BALL BOND
PROBLEM TO BE SOLVED: To provide systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad.SOLUTION: The ball bond allows the use of particularly small bonding pads that are p...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad.SOLUTION: The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles. |
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