AMBIENT TEMPERATURE BALL BOND

PROBLEM TO BE SOLVED: To provide systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad.SOLUTION: The ball bond allows the use of particularly small bonding pads that are p...

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Bibliographische Detailangaben
Hauptverfasser: JOEL W HOEHN, JOHN L IBELE, RUUPIN LEE, JOE J SCHOBEL, MARK A HERENDEEN, RALPH MARQUART, EDWARD KNUTSON, SARAVUTH KEO, KARA L MAYTAG, JEFF R O'KONSKI, PRAMIT P PARIKH, ROGER L HIPWELL
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad.SOLUTION: The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.