SUBSTRATE PROCESSING APPARATUS
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can uniformly and efficiently process a principal surface of a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a spin chuck 2; first through third chemical nozzles 31-33 for discharging a chemical; first throug...
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| creator | MIYAGI MASAHIRO |
| description | PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can uniformly and efficiently process a principal surface of a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a spin chuck 2; first through third chemical nozzles 31-33 for discharging a chemical; first through third arms 41-43 for supporting the first through third chemical nozzles 31-33, respectively; and an arm drive mechanism 5 for swinging the first through third arms 41-43. Relative postures of the first through third arms 41-43 are changed depending on a movement position of the arm 4 and in association with the change, relative positions of the first through third chemical nozzles 31-33 are changed. This makes it possible to make droplet landing positions of the chemical supplied to a surface of a substrate W from the first through third chemical nozzles 31-33 follow surface peripheral parts W, Wof the substrate W. |
| format | Patent |
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Relative postures of the first through third arms 41-43 are changed depending on a movement position of the arm 4 and in association with the change, relative positions of the first through third chemical nozzles 31-33 are changed. This makes it possible to make droplet landing positions of the chemical supplied to a surface of a substrate W from the first through third chemical nozzles 31-33 follow surface peripheral parts W, Wof the substrate W.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140821&DB=EPODOC&CC=JP&NR=2014150135A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140821&DB=EPODOC&CC=JP&NR=2014150135A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAGI MASAHIRO</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can uniformly and efficiently process a principal surface of a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a spin chuck 2; first through third chemical nozzles 31-33 for discharging a chemical; first through third arms 41-43 for supporting the first through third chemical nozzles 31-33, respectively; and an arm drive mechanism 5 for swinging the first through third arms 41-43. Relative postures of the first through third arms 41-43 are changed depending on a movement position of the arm 4 and in association with the change, relative positions of the first through third chemical nozzles 31-33 are changed. This makes it possible to make droplet landing positions of the chemical supplied to a surface of a substrate W from the first through third chemical nozzles 31-33 follow surface peripheral parts W, Wof the substrate W.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQxNDUwNDY1NHY6IUAQAYViIQ</recordid><startdate>20140821</startdate><enddate>20140821</enddate><creator>MIYAGI MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20140821</creationdate><title>SUBSTRATE PROCESSING APPARATUS</title><author>MIYAGI MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014150135A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAGI MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAGI MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS</title><date>2014-08-21</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can uniformly and efficiently process a principal surface of a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a spin chuck 2; first through third chemical nozzles 31-33 for discharging a chemical; first through third arms 41-43 for supporting the first through third chemical nozzles 31-33, respectively; and an arm drive mechanism 5 for swinging the first through third arms 41-43. Relative postures of the first through third arms 41-43 are changed depending on a movement position of the arm 4 and in association with the change, relative positions of the first through third chemical nozzles 31-33 are changed. This makes it possible to make droplet landing positions of the chemical supplied to a surface of a substrate W from the first through third chemical nozzles 31-33 follow surface peripheral parts W, Wof the substrate W.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| title | SUBSTRATE PROCESSING APPARATUS |
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