SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can uniformly and efficiently process a principal surface of a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a spin chuck 2; first through third chemical nozzles 31-33 for discharging a chemical; first through third arms 41-43 for supporting the first through third chemical nozzles 31-33, respectively; and an arm drive mechanism 5 for swinging the first through third arms 41-43. Relative postures of the first through third arms 41-43 are changed depending on a movement position of the arm 4 and in association with the change, relative positions of the first through third chemical nozzles 31-33 are changed. This makes it possible to make droplet landing positions of the chemical supplied to a surface of a substrate W from the first through third chemical nozzles 31-33 follow surface peripheral parts W, Wof the substrate W.