LIGHT-EMITTING DIODE DEVICE NOT REQUIRING PACKAGE PROCESS NOR CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To achieve the effect of enhancing the reliability and yield while reducing the cost, by simplifying the element constitution and package process and assembly process to a minimum.SOLUTION: In a light-emitting diode device not requiring a package process nor a circuit board, and a manufacturing method therefor, any substrate for semiconductor package and a printed circuit board are not required. Mainly, two electrodes and one or a plurality of chip elements that can be connected externally by means of wires are provided on a light-emitting diode chip. The two electrodes are conducted by being connected electrically and directly with a DC power supply or an AC power supply by means of wires, and light is emitted from the light-emitting diode.