RESIN COMPOSITION AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME

PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in adhesive strength, quick curability, and moisture resistance, and to provide a highly reliable semiconductor device which is excellent in solder crack resistance when using the resin composition as a die attach material for a...

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Bibliographische Detailangaben
1. Verfasser:	MURAYAMA RYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in adhesive strength, quick curability, and moisture resistance, and to provide a highly reliable semiconductor device which is excellent in solder crack resistance when using the resin composition as a die attach material for a semiconductor.SOLUTION: The resin composition contains: (A) a bismaleimide compound having a polyalkylene oxide skeleton; (B) an allyl ester compound having a polyalkylene oxide skeleton; (C) a (meth)acrylate having a hydroxycarbonyl group; (D) a (meth)acrylate having a hydroxyl group; (E) a radical initiator; and (F) a filler.