INTEGRATED THIN FILM EVAPORATION THERMAL SPREADER AND PLANAR HEAT PIPE HEAT SINK

INTEGRATED THIN FILM EVAPORATION THERMAL SPREADER AND PLANAR HEAT PIPE HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat dissipation device and heat dissipation method that provides thermal spreading and thermal cooling for a heat-producing body.SOLUTION: A thin film evaporator in thermal communication with the heat-producing body removes heat from the heat-producing body using...

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Bibliographische Detailangaben
1. Verfasser: JOHN STEVEN PASCHKEWITZ
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat dissipation device and heat dissipation method that provides thermal spreading and thermal cooling for a heat-producing body.SOLUTION: A thin film evaporator in thermal communication with the heat-producing body removes heat from the heat-producing body using a working fluid. A heat pipe integrated with and extending from the thin film evaporator dissipates heat removed by the thin film evaporator to the external environment of the heat dissipation device. A pumping element is configured to 1) pump the working fluid to the thin film evaporator and/or 2) augment transfer of the working fluid to the thin film evaporator.