WIRING BOARD AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 1...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MURAKAMI KENSAKU, ONIZUKA YURIE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	MURAKAMI KENSAKU ONIZUKA YURIE
description	PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 13 for plating which are provided on surface or in the inside of the insulation substrate 11 and connected to the conductor 12. The plurality of wiring 13 for plating are connected to the conductor 12 so that the same number of the wiring 13 for plating is connected to a plurality of virtual regions obtained by dividing a loading part 121 constituting the conductor 12 equally into three or more.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014143359A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014143359A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014143359A3</originalsourceid><addsrcrecordid>eNrjZFAK9wzy9HNXcPJ3DHJRcPRzUXD1cXUOCfL383RWcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGJoYmxsamlo7GRCkCAGBmIqA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WIRING BOARD AND ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>MURAKAMI KENSAKU ; ONIZUKA YURIE</creator><creatorcontrib>MURAKAMI KENSAKU ; ONIZUKA YURIE</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 13 for plating which are provided on surface or in the inside of the insulation substrate 11 and connected to the conductor 12. The plurality of wiring 13 for plating are connected to the conductor 12 so that the same number of the wiring 13 for plating is connected to a plurality of virtual regions obtained by dividing a loading part 121 constituting the conductor 12 equally into three or more.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140807&DB=EPODOC&CC=JP&NR=2014143359A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140807&DB=EPODOC&CC=JP&NR=2014143359A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MURAKAMI KENSAKU</creatorcontrib><creatorcontrib>ONIZUKA YURIE</creatorcontrib><title>WIRING BOARD AND ELECTRONIC DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 13 for plating which are provided on surface or in the inside of the insulation substrate 11 and connected to the conductor 12. The plurality of wiring 13 for plating are connected to the conductor 12 so that the same number of the wiring 13 for plating is connected to a plurality of virtual regions obtained by dividing a loading part 121 constituting the conductor 12 equally into three or more.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAK9wzy9HNXcPJ3DHJRcPRzUXD1cXUOCfL383RWcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGJoYmxsamlo7GRCkCAGBmIqA</recordid><startdate>20140807</startdate><enddate>20140807</enddate><creator>MURAKAMI KENSAKU</creator><creator>ONIZUKA YURIE</creator><scope>EVB</scope></search><sort><creationdate>20140807</creationdate><title>WIRING BOARD AND ELECTRONIC DEVICE</title><author>MURAKAMI KENSAKU ; ONIZUKA YURIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014143359A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MURAKAMI KENSAKU</creatorcontrib><creatorcontrib>ONIZUKA YURIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURAKAMI KENSAKU</au><au>ONIZUKA YURIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING BOARD AND ELECTRONIC DEVICE</title><date>2014-08-07</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 13 for plating which are provided on surface or in the inside of the insulation substrate 11 and connected to the conductor 12. The plurality of wiring 13 for plating are connected to the conductor 12 so that the same number of the wiring 13 for plating is connected to a plurality of virtual regions obtained by dividing a loading part 121 constituting the conductor 12 equally into three or more.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2014143359A
source	esp@cenet
subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	WIRING BOARD AND ELECTRONIC DEVICE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T18%3A02%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MURAKAMI%20KENSAKU&rft.date=2014-08-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014143359A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true