WIRING BOARD AND ELECTRONIC DEVICE

WIRING BOARD AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 1...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MURAKAMI KENSAKU, ONIZUKA YURIE
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring board capable of depositing an electrolytic plating layer little varied in the thickness thereon.SOLUTION: A wiring board includes: an insulation substrate 11; a conductor 12 provided on the surface of the insulation substrate 11; and a plurality of wiring 13 for plating which are provided on surface or in the inside of the insulation substrate 11 and connected to the conductor 12. The plurality of wiring 13 for plating are connected to the conductor 12 so that the same number of the wiring 13 for plating is connected to a plurality of virtual regions obtained by dividing a loading part 121 constituting the conductor 12 equally into three or more.