PLACING STAND AND PLASMA PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a placing stand able to prevent abnormal discharge, and to provide a plasma processing apparatus that has the placing stand.SOLUTION: A placing stand to which a voltage can be applied comprises: an electrostatic chuck having a placing surface on which a body to be processed is placed and a rear surface opposite to the placing surface, and including a first through-hole formed on the placing surface; a base jointed to the rear surface of the electrostatic chuck and having a second through-hole communicating with the first through-hole; and a lifter pin accommodated in the first through-hole and second through-hole, moved vertically so as to freely project or retract from the placing surface, and used for supporting on the placing surface the body to be processed. The upper end of the first through-hole has a shape decreased gradually toward the lower end thereof. The upper end of the lifter pin has a shape decreased gradually toward the lower end so as to correspond to the shape of the upper end of the first through-hole. When the lifter pin is accommodated in the first through-hole and second through-hole, this pin comes into face contact with the upper end of the first through-hole.