NON-CONTACT IC LABEL AND ARTICLE WITH NON-CONTACT IC LABEL

PROBLEM TO BE SOLVED: To provide a non-contact IC label capable of communicating by being attached to a metal adherend and having a re-labeling prevention function.SOLUTION: A non-contact IC label 1 includes: a magnetic sheet 10; a film-like base material 32 attached with a first main surface 32a on...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: OMURA KUNIO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a non-contact IC label capable of communicating by being attached to a metal adherend and having a re-labeling prevention function.SOLUTION: A non-contact IC label 1 includes: a magnetic sheet 10; a film-like base material 32 attached with a first main surface 32a on the other face 10b of the magnetic sheet via a first adhesive layer 31; a ground part 33 arranged on a second main surface 32b of the base material; a through-wiring 34 connected to the ground part provided inside a hole part 32c penetrating the base material; a linkage wiring 35 connected to the through-wiring at the first main surface side in the base material and connected to an impedance matching circuit part; a second adhesive layer 36 arranged so as to cover the ground part at the second main surface side in the base material; and a peeling layer 37 arranged so as to cover the hole part between the linkage wiring and the first adhesive layer.