MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin capable of suppressing manufacture of a defective optical semiconductor device, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component of a lead frame with a resin R comprises: a multiple mounted component MS of a lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to at least of one surface of terminal parts 11, 12, is multiple-mounted to a frame F; and a light reflection resin layer 20 consisting of a frame resin part 20a formed on an outer peripheral side of the lead frame 10 and between terminal parts 11, 12, a reflector resin part 20b formed to be projected on the outer surface of the lead frame 10, a frame resin part 20c formed on at least part of the front or rear surface of the frame F and connected to the frame resin part 20a and a side surface resin part 20d connected to the frame resin part 20c and formed on at least part of the outer peripheral side of the frame F.