SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which can form an opening having a sufficient opening diameter in a region sandwiched by a pair of bit lines and in which a high-quality contact using the opening is formed.SOLUTION: A semiconductor device comprises: a first conductive layer BS...

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Bibliographische Detailangaben
1. Verfasser:	MAKI YUKIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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