FLEXIBLE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of easily and surely improving.SOLUTION: The flexible printed wiring board comprises: a substrate having insulation properties and flexibility; a first conductive pattern having a layer derived from a metal film stacked on a su...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of easily and surely improving.SOLUTION: The flexible printed wiring board comprises: a substrate having insulation properties and flexibility; a first conductive pattern having a layer derived from a metal film stacked on a substrate surface and a conductive material layer stacked on the layer derived from the metal film; a second conductive pattern stacked on a rear surface of the substrate; and a blind via hole made of a conductive material, which is continued from the conductive material layer and filled so as to pass through the layer derived from the metal film and the substrate. An average thickness of the conductive material layer is equal to or more than 2 μm and equal to or less than 8 μm. It is preferred that an average thickness of the layer derived from the metal film is equal to or more than 3 μm and equal to or less than 8 μm. It is preferred that the layer derived from the metal film is not exposed to the surface. |
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