PRINTED WIRING SUBSTRATE FOR HIGH-FREQUENCY CIRCUIT

PROBLEM TO BE SOLVED: To provide a substrate for a circuit capable of reducing a transmission loss of an electric signal in high-frequency use application, and having a high adhesion property between a resin layer and a metal foil circuit and an excellent solder resistance reflow property.SOLUTION:...

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Hauptverfasser: MOGI SHIGERU, TSUJI MAKOTO, AKATSUKA YASUMASA, TAKAMOTO TAIHEI, UCHIDA MAKOTO
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creator MOGI SHIGERU
TSUJI MAKOTO
AKATSUKA YASUMASA
TAKAMOTO TAIHEI
UCHIDA MAKOTO
description PROBLEM TO BE SOLVED: To provide a substrate for a circuit capable of reducing a transmission loss of an electric signal in high-frequency use application, and having a high adhesion property between a resin layer and a metal foil circuit and an excellent solder resistance reflow property.SOLUTION: A soluble polyimide resin layer is formed as a primer resin layer for securing adhesiveness with a thermosetting polyimide resin layer on a copper foil. Next, polyamic acid solution obtained by reacting p-phenylenediamine and the like and 3,3'4,4'-biphenyl tetracarboxylic acid dianhydride and the like is applied on a primer layer. Two single layer substrates obtained by heating and curing after drying are prepared. A double-sided substrate for a high-frequency circuit is obtained by sandwiching a fluorine resin film between polyimide surfaces of the two single layer substrates and performing thermal compression bonding.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
title PRINTED WIRING SUBSTRATE FOR HIGH-FREQUENCY CIRCUIT
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