PRINTED WIRING SUBSTRATE FOR HIGH-FREQUENCY CIRCUIT

PROBLEM TO BE SOLVED: To provide a substrate for a circuit capable of reducing a transmission loss of an electric signal in high-frequency use application, and having a high adhesion property between a resin layer and a metal foil circuit and an excellent solder resistance reflow property.SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	MOGI SHIGERU, TSUJI MAKOTO, AKATSUKA YASUMASA, TAKAMOTO TAIHEI, UCHIDA MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate for a circuit capable of reducing a transmission loss of an electric signal in high-frequency use application, and having a high adhesion property between a resin layer and a metal foil circuit and an excellent solder resistance reflow property.SOLUTION: A soluble polyimide resin layer is formed as a primer resin layer for securing adhesiveness with a thermosetting polyimide resin layer on a copper foil. Next, polyamic acid solution obtained by reacting p-phenylenediamine and the like and 3,3'4,4'-biphenyl tetracarboxylic acid dianhydride and the like is applied on a primer layer. Two single layer substrates obtained by heating and curing after drying are prepared. A double-sided substrate for a high-frequency circuit is obtained by sandwiching a fluorine resin film between polyimide surfaces of the two single layer substrates and performing thermal compression bonding.