WAVEGUIDE TYPE OPTICAL DEVICE MODULE AND METHOD OF MANUFACTURING WAVEGUIDE TYPE OPTICAL DEVICE MODULE

WAVEGUIDE TYPE OPTICAL DEVICE MODULE AND METHOD OF MANUFACTURING WAVEGUIDE TYPE OPTICAL DEVICE MODULE

PROBLEM TO BE SOLVED: To provide a waveguide type optical device module of high reliability and a method of manufacturing the same.SOLUTION: The waveguide type optical device module includes: an enclosure package 12 formed of a top-opened box; an optical chip arranged in the enclosure package 12; an...

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Bibliographische Detailangaben
Hauptverfasser: IGARASHI NOBUHIRO, KAWAZURA EIJI, NANAMI MASAYA, KITO TSUTOMU, SATO YUJI, KONO KENJI
Format: Patent
Sprache:eng
Schlagworte:
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a waveguide type optical device module of high reliability and a method of manufacturing the same.SOLUTION: The waveguide type optical device module includes: an enclosure package 12 formed of a top-opened box; an optical chip arranged in the enclosure package 12; an optical fiber array optically coupled to the optical chip and connected and fixed to it; and a cover part 10a closing the opening of the enclosure package 12. The enclosure package 12 has a through hole part in a wall part thereof, and a ferrule 15 is attached to a fiber jacket 16 of optical fibers, and a second optical fiber array comprising an optical fiber array holding pedestal 14 where the ferrule is hermetically sealed and fixed to the through hole part in the through hole part, and the cover part 10a is hermetically sealed and fixed to the opening of the enclosure package 12.