CASE FOR ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a case for electronic equipment capable of firmly integrating and improving appearance when a resin material is injection molded to an FRP plate consisting a thermoplastic resin as a parent material.SOLUTION: There is provided a case for electronic equipment 15 formed by making a prepreg thin plate 10 by coating a continuous fiber 11 with a thermoplastic resin 12, compression working the prepreg thin plate 10 with a press mold having convexoconcave on at least a part of surface to deform the continuous fiber 11 in the prepreg thin plate 10 to a rugged shape, removing the thermoplastic resin 12 by cutting work to expose the continuous fiber 11 positioning in a surface layer part of the deformed prepreg thin plate 10 to the surface layer part of the prepreg thin plate 10 with convex or concave, and laminating a resin material 14 containing a reinforced fiber 13 so that the continuous fiber 11 covers a surface of the exposed prepreg thin plate 10 with convex or concave.