HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink which is lightweight yet excellent in heat radiation performance.SOLUTION: A heat sink 10 includes: a heat receiving block 1 where a light emitting element substrate is thermally connected with one surface; a plate-like member 4 which is provided at a reg...

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Bibliographische Detailangaben
1. Verfasser:	TOGASHI KENGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat sink which is lightweight yet excellent in heat radiation performance.SOLUTION: A heat sink 10 includes: a heat receiving block 1 where a light emitting element substrate is thermally connected with one surface; a plate-like member 4 which is provided at a region of the surface of the heat receiving block 1 that excludes a portion with which the light emitting element substrate is connected, is thinner than the heat receiving block 1, and has thermal conductivity lower than the heat receiving block 1; a heat pipe 2 where the one end part side is thermally connected with the heat receiving block 1; and fins 3 which are thermally connected with the other end part side of the heat pipe 2 and are disposed spaced away from the heat receiving block 1.