ELECTRONIC COMPONENT WITH BUMP AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT WITH BUMP

PROBLEM TO BE SOLVED: To prevent change in characteristics of a semiconductor chip and poor connection between a semiconductor substrate and a mounting substrate.SOLUTION: An electronic component with bump comprises a circuit board 1, and bumps B1, B2 which are formed on a substrate principal surfac...

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Bibliographische Detailangaben
Hauptverfasser:	OBE ISAO, OSAKABE SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent change in characteristics of a semiconductor chip and poor connection between a semiconductor substrate and a mounting substrate.SOLUTION: An electronic component with bump comprises a circuit board 1, and bumps B1, B2 which are formed on a substrate principal surface of the circuit board 1 and which have different cross sectional areas in a direction parallel with the substrate principal surface. The bump B1 among the bumps B1, B2 which has a smaller cross sectional area has a height control layer 5 in a vertical direction.