TERMINAL MANUFACTURING METHOD AND TERMINAL

PROBLEM TO BE SOLVED: To prevent a decrease in the thickness of a sealing film while facilitating electric connection with an external conductor.SOLUTION: A manufacturing method for a terminal including a conductive member 11 having electric connection parts 11b and 11c to which a lead wire 80 (exte...

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1. Verfasser: KAWASHIMA SEIZABURO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a decrease in the thickness of a sealing film while facilitating electric connection with an external conductor.SOLUTION: A manufacturing method for a terminal including a conductive member 11 having electric connection parts 11b and 11c to which a lead wire 80 (external conductor) and a terminal 72 (external conductor) of a hole IC are connected, and a sealing film 12 provided on the surface of an intermediate part 11a (specific portion) of the conductive member 11 comprises: a processing step in which the end parts of a flat rod of a rectangular cross-section are used as the electric connection parts 11b and 11c, and the intermediate part 11ax of the flat rod are processed so that the corners of the rectangular cross-section are rounded; an application step in which a liquid sealing agent is applied to the intermediate part 11a thereafter; and a curing step in which the applied liquid sealing agent is cured, thereby forming a sealing film 12.