SEMICONDUCTOR ELEMENT MOUNTING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide means of enabling mounting of a first semiconductor element on a first printed wiring board by easily positioning the semiconductor element at an original position even when a second solder bump with a height higher than that of a first solder bump exists around the...

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Bibliographische Detailangaben
Hauptverfasser:	FURUTA TORU, KURODA NOBUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide means of enabling mounting of a first semiconductor element on a first printed wiring board by easily positioning the semiconductor element at an original position even when a second solder bump with a height higher than that of a first solder bump exists around the first solder bump.SOLUTION: A semiconductor element mounting printed wiring board 10 includes: a first solder bump 76U for connection of a first semiconductor element; and a second solder bump 76S for connection of a second semiconductor element, which lies at a position surrounding the first solder bump and has a height higher than that of the first solder bump, in which a tip of the first solder bump has a flat surface in parallel with an extension direction of the semiconductor element mounting printed wiring board.