DEPOSITION METHOD OF SILICON FILM AND DEPOSITION FILM DEVICE

PROBLEM TO BE SOLVED: To provide a deposition method of a silicon film which can respond to a reduction request of a film thickness, and which can improve the accuracy of surface roughness.SOLUTION: A deposition method of a silicon film comprises: a step (step 1) in which a base is heated, aminosila...

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Hauptverfasser: NAGATA TOMOYUKI, MIYAHARA TAKAHIRO, OBE SATOYUKI
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creator NAGATA TOMOYUKI
MIYAHARA TAKAHIRO
OBE SATOYUKI
description PROBLEM TO BE SOLVED: To provide a deposition method of a silicon film which can respond to a reduction request of a film thickness, and which can improve the accuracy of surface roughness.SOLUTION: A deposition method of a silicon film comprises: a step (step 1) in which a base is heated, aminosilane based gas is supplied to the heated base-surface, and a seed layer is formed on the base surface; and a step (step 2) in which the base is heated, silane gas including no amino group is supplied to the seed layer on the heated base-surface, and a silicon film is formed on the seed layer. The aminosilane based gas used in the step 1 includes two silicons or more in the molecular formula of the aminosilane based gas.
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title DEPOSITION METHOD OF SILICON FILM AND DEPOSITION FILM DEVICE
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