PROCESS CONDITION MEASUREMENT DEVICE

PROBLEM TO BE SOLVED: To provide a device which measures the temperature of wafers under exposure.SOLUTION: The device which measures parameters comprises: a substrate; a plurality of sensors 101-105 which measure parameters independently in different positions and are carried to the face of the substrate to be arranged thereon; electric conductors which spread on the surface and are connected to the sensors 101-105 and an electronic process component; and a cover which is arranged on the sensors 101-105, the electronic process component, and the conductors. The cover and the substrate have the same material characteristics to a manufacturing substrate to be processed by a substrate process cell. The present device has the approximately same thickness and/or flatness as that of the manufacturing substrate. A substrate process may be applied to the present device, and one or more parameters may be measured during the process using the present device. On the basis of parameter measurement by one or more sensors 101-105, operation characteristic of manufacturing wafers in the substrate process may be analyzed.