PROTECTIVE FILM FOR FPC, RESIN CONDUCTOR FOIL LAMINATE WITH PROTECTIVE FILM FOR FPC, AND METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD USING IT

PROBLEM TO BE SOLVED: To provide a resin conductor foil laminate which prevents chemical pollution of the resin surface of the resin conductor foil laminate or contamination of the resin surface with a foreign matter or a flaw while ensuring excellent handleability, and to provide a method of manufa...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI MASUFUMI, ORII HIROMITSU, TAIMA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin conductor foil laminate which prevents chemical pollution of the resin surface of the resin conductor foil laminate or contamination of the resin surface with a foreign matter or a flaw while ensuring excellent handleability, and to provide a method of manufacturing a flexible printed wiring board capable of simultaneous processing of both sides with high productivity.SOLUTION: The protective film for FPC has an adhesive layer for sticking a resin layer on one or both sides of a polyethylene terephthalate substrate which has a heat shrinkage rate of 0.5% or less in both length direction and width direction in conditions of 150°C, 30 minutes. The protective film for FPC is stuck detachably to the polyimide resin layer surface of a conductor foil laminate on which a polyimide resin layer is laminated with the adhesive layer for sticking a resin layer interposed therebetween.