SUBSTRATE CLEANING SYSTEM, SUBSTRATE CLEANING METHOD AND STORAGE MEDIUM

PROBLEM TO BE SOLVED: To remove particles adhering to a substrate, while suppressing pattern collapse or erosion of a base film.SOLUTION: A substrate cleaning system comprises: a first processing section; and a second processing section. The first processing section includes a first holding section...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KANEKO MIYAKO, SUGANO ITARU, ORII TAKEHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To remove particles adhering to a substrate, while suppressing pattern collapse or erosion of a base film.SOLUTION: A substrate cleaning system comprises: a first processing section; and a second processing section. The first processing section includes a first holding section for holding a substrate, and a first supply section for supplying a process liquid containing a volatile component and forming a film entirely on the principal surface of the substrate. The second processing section includes a second holding section for holding a substrate, and a second supply section supplying a removal liquid for entirely melting a film formed on the substrate when the volatile component volatilizes from the process liquid supplied to the substrate by the first supply section, and the process liquid is solidified or hardened.