POLYIMIDE FILMS, AND POLYIMIDE LAMINATE AND POLYIMIDE/METAL LAMINATE THEREOF

PROBLEM TO BE SOLVED: To provide a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer.SOLUTION: The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) laminated in contact with the polyimide layer (b). The polyimide layer (a) is obta...

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Bibliographische Detailangaben
Hauptverfasser:	OISHI YOSHIYUKI, YOKOZAWA YOSHIHIRO, KUNO SHINJI, KODA MASAFUMI, KOHAMA SHINICHIRO, OISHI KOSUKE, YAMAGUCHI HIROAKI, MIURA TORU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer.SOLUTION: The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) laminated in contact with the polyimide layer (b). The polyimide layer (a) is obtained from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by the specified general formula (1), where Rdenotes a hydrogen atom, or a C1-C12 alkyl group or aryl group, and Rdenotes a C1-C12 alkyl group or aryl group.