MOLD RELEASE FILM

PROBLEM TO BE SOLVED: To provide a mold release film which is used in a hot press when a circuit board is produced and which can have both of embeddability into a circuit exposure film and mold releasability after hot-pressed.SOLUTION: The mold release film has a rigid layer, a cushion layer, and a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TANIGUCHI YUTO
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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