MOLD RELEASE FILM

PROBLEM TO BE SOLVED: To provide a mold release film which is used in a hot press when a circuit board is produced and which can have both of embeddability into a circuit exposure film and mold releasability after hot-pressed.SOLUTION: The mold release film has a rigid layer, a cushion layer, and a...

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Bibliographische Detailangaben
1. Verfasser:	TANIGUCHI YUTO
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mold release film which is used in a hot press when a circuit board is produced and which can have both of embeddability into a circuit exposure film and mold releasability after hot-pressed.SOLUTION: The mold release film has a rigid layer, a cushion layer, and a release layer in this order and is characterized in that the elastic modulus of the rigid layer is 1.0×10Pa or higher at 140°C. When the elastic modulus of the rigid layer is A at 140°C and that of the rigid layer is B at 160°C, 0.001≤B/A≤10 is preferably satisfied.