SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor apparatus in which a semiconductor device is mounted on a metal basal portion, the semiconductor apparatus more stably operating by being given resistance against a noise from the basal portion.SOLUTION: A semiconductor apparatus 1 includes: a metal b...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHIMAKURA KEI, KATO HISATO, HARADA SHUNSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor apparatus in which a semiconductor device is mounted on a metal basal portion, the semiconductor apparatus more stably operating by being given resistance against a noise from the basal portion.SOLUTION: A semiconductor apparatus 1 includes: a metal basal portion 2; a semiconductor device 10 mounted on the basal portion 2; an insulator 3 interposed between the basal portion 2 and the semiconductor device 10; and external connection terminals 4a and 4b provided in the basal portion while being insulated from the basal portion. The semiconductor apparatus 1 further includes an impedance structure part 20 which is attached to the basal portion 2 between the basal portion 2 and the semiconductor device 10 so as to be located in an intrusion path of a noise intruding from the basal portion 2 to the semiconductor device 10 via a parasitic capacitance between the basal portion 2 and the semiconductor device 10, and which shows a high impedance to the noise.