MANUFACTURING METHOD OF CONNECTION STRUCTURE, CONNECTION METHOD AND CONNECTION STRUCTURE

PROBLEM TO BE SOLVED: To prevent conductivity from being deteriorated by lack of hardening, by suppressing dissipation of heat of a thermal compression tool.SOLUTION: According to a manufacturing method, a substrate 2 with a connection terminal 7 formed on one side is disposed on a connection object...

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1. Verfasser: MIYAUCHI KOICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent conductivity from being deteriorated by lack of hardening, by suppressing dissipation of heat of a thermal compression tool.SOLUTION: According to a manufacturing method, a substrate 2 with a connection terminal 7 formed on one side is disposed on a connection object 1 in which an electrode terminal 6 connected with the connection terminal 7 is formed, via an adhesive 7 in such a manner that the connection terminal 7 and the electrode terminal 6 oppose each other. The substrate 2 is heated/pressed, on the connection terminal 7, from the other side opposite to the one side where the connection terminal 7 is formed, by a thermal compression tool 20, such that the adhesive 3 is hardened and a connection structure to which the substrate 2 is connected is manufactured. The manufacturing method comprises an auxiliary heating tool 21 which heats and presses the substrate 2 from the other side independently of the thermal compression tool 20, and includes a step of heating and pressing continuous portions which are different from the portion thermally pressurized by the thermal compression tool 20, via the connection terminal 7 or the electrode terminal 6 and a conductive pattern 10 by means of the auxiliary heating tool 21 during thermal pressing using the thermal pressurization tool 20.