SUBSTRATE LIQUID PROCESSING APPARATUS, AND SUBSTRATE LIQUID PROCESSING METHOD

PROBLEM TO BE SOLVED: To shorten a time required for a drying step without elongating a processing time of the drying step of liquid processing to a substrate and without causing a failure state in the vicinity of a notch part on a substrate surface.SOLUTION: A substrate liquid processing apparatus comprises: a rear face purge nozzle 15 that has a slit-like opening 15a arranged between a chuck 13 freely rotatably holding a wafer and a lower part of a rear face side of a peripheral edge part in a wafer radial direction, and extending in the wafer radial direction, and that is configured so that a gap where the opening and the wafer rear face are opposed to each other is widened as it approaches from an outer end side of the wafer toward a center part side, and that sprays a gas in a straight line toward the rear face of the wafer; and a peripheral purge nozzle 16 that is provided in a region between an end part of the rear face purge nozzle at an outer side of the wafer and the rear face at an inner side of the wafer from the end surface of the peripheral edge part, and that sprays a gas to the rear face of the wafer. A gas is sprayed to the rear face of the wafer from the rear face purge nozzle and the peripheral purge nozzle while a controller H controls a rotation drive motor M to rotate the wafer at a low speed which gives a weak centrifugal force.