POLYIMIDE RESIN SOLUTION

POLYIMIDE RESIN SOLUTION

PROBLEM TO BE SOLVED: To provide a polyimide resin solution capable of providing polyimide film having low CTE, and good in maneuverability because of no need for considering effects of moisture in the solution.SOLUTION: There is provided a solution having a specific structure unit and containing po...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OZAWA SHINJI, OKAMOTO SHINHEI, MASUDA NAGAHIRO
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyimide resin solution capable of providing polyimide film having low CTE, and good in maneuverability because of no need for considering effects of moisture in the solution.SOLUTION: There is provided a solution having a specific structure unit and containing polyimide having carboxylic acid anhydride or carboxylic acid at a terminal of a molecular chain, a crosslinking agent which reacts with carboxylic acid anhydride or carboxylic acid having at least one kind of an epoxy group, an oxazoline group, a double bond, an amino group, an aldehyde group, a hydroxyl group and a carboxyl group.