SUBSTRATE PEELING DEVICE AND PEELING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a substrate peeling device, a peeling method and a method for manufacturing an electronic device in which a substrate can be peeled satisfactorily even when crack has occurred in the substrate.SOLUTION: The substrate peeling device peels a substrate 2 from a reinforcement plate for reinforcing the substrate 2 at a boundary surface between the substrate 2 and the reinforcement plate sequentially from a corner part 8 side toward a corner part 9 side. In a peeling range 12 in which angles formed by a linear line H and tangential lines J and K of an outer periphery of the substrate 2 is at least 90 degrees or less (where, the linear line H connects two intersection points F and G; the F and G are intersection points between a peeling front line E and the outer periphery of the substrate 2 in a peeling area 10 in which the substrate 2 has been peeled from the reinforcement plate at the boundary surface; the front line E is a boundary line between the peeling area 10 and a non-peeling area 11), the substrate 2 is peeled from the reinforcement plate at the boundary surface so that an angle formed by tangential lines M and N of edges of the peeling front line E and the respective tangential lines J and K becomes greater than 90 degrees.