ELECTRONIC CIRCUIT MODULE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To maintain a desired shield effect while inhibiting the occurrence of burrs.SOLUTION: An electronic circuit module according to one embodiment of the invention includes: a component built-in substrate; a mounting component; a sealing part; and a shield part formed by a conduct...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAMADA YOSHIKI, IDA KAZUAKI, SARUWATARI TATSURO, SUGIYAMA YUICHI, MIYAZAKI MASASHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To maintain a desired shield effect while inhibiting the occurrence of burrs.SOLUTION: An electronic circuit module according to one embodiment of the invention includes: a component built-in substrate; a mounting component; a sealing part; and a shield part formed by a conductive synthetic resin. The component built-in substrate includes: a metal core layer; an exterior part formed by an insulative synthetic resin; and a first protruding part. The core layer has a corner part and a side surface and serves as ground wiring. The exterior part covers the corner part and the side surface and has a first surface. The first protruding part includes: a first end surface exposed from the exterior part and a second surface located adjacent to the first surface and is formed at a position separated from the corner part on the side surface so as to extend outward. The mounting component is mounted on the component built-in substrate. The sealing part covers the mounting component. The shield part covers the sealing part and has a third surface which closely adheres to the first surface and the second surface.