SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves high adhesion between a die pad on which a semiconductor element is placed and a resin sheet and high heat radiation performance, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a die pad 5; a semiconductor element 7 which is joined to an upper surface of the die pad 5; and a resin sheet 4 which adheres to a lower surface of the die pad 5. The semiconductor element 7 is resin-sealed with the die pad 5 and the resin sheet 4. A recessed part 5a is formed on the lower surface of the die pad 5 and the recessed part 5a is filled with a part of the resin sheet 4. The structure allows the lower surface of the die pad 5, which includes the recessed part 5a, and the resin sheet 4 to adhere to each other.