CERAMIC SUBSTRATE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING PACKAGE USING THE SAME

PROBLEM TO BE SOLVED: To provide a ceramic substrate for housing an electronic component in which high airtightness can be maintained, even if the width of a metal layer formed on the surface of a substrate bank is narrow, and to provide an electronic component mounting package to which the ceramic...

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Bibliographische Detailangaben
1. Verfasser:	YAMAMOTO SENTARO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramic substrate for housing an electronic component in which high airtightness can be maintained, even if the width of a metal layer formed on the surface of a substrate bank is narrow, and to provide an electronic component mounting package to which the ceramic substrate is applied.SOLUTION: A ceramic substrate for housing an electronic component includes a planar substrate bottom 3 having a mounting surface 1 of an electronic component 10, a frame-like substrate bank 5 arranged to surround the mounting surface 1 on the substrate bottom 3, and a metal layer 9 arranged circumferentially on the surface of the substrate bank 5. The metal layer 9 is provided to spread from the upper surface 5a of the substrate bank 5 to the side face 5b. Consequently, a ceramic substrate for housing an electronic component with high airtightness, and an electronic component mounting package to which the ceramic substrate is applied can be obtained.