ELECTRONIC DEVICE MANUFACTURING METHOD AND MULTILAYERED GLASS LAMINATE

PROBLEM TO BE SOLVED: To provide an electronic device manufacturing method excellent in productivity.SOLUTION: An electronic device manufacturing method, which includes a glass substrate with an adhesion layer comprising a glass substrate and an adhesion layer fixed on one principal plane of the gla...

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Bibliographische Detailangaben
Hauptverfasser:	EHATA KENICHI, TSUDA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic device manufacturing method excellent in productivity.SOLUTION: An electronic device manufacturing method, which includes a glass substrate with an adhesion layer comprising a glass substrate and an adhesion layer fixed on one principal plane of the glass substrate, and a member for an electronic device, comprises: a first process of forming a multilayered glass laminate having a support substrate and a plurality of the glass substrates with the adhesion layers, laminated and arranged on the support substrate; and a second process of obtaining a plurality of electronic devices by repeating a step A of obtaining a laminate with a member for an electronic device by forming a member for an electronic device on the glass substrate with the adhesion layer, arranged on the outermost side of the multilayered glass laminate and a step B of peeling the electronic device having the glass substrate with the adhesion layer arranged on the outermost side and the member for the electronic device from the laminate with the member for the electronic device.