PHYSICAL QUANTITY SENSOR AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To reduce a stress to be applied to a sensing part.SOLUTION: As a sensor chip 20, grooves 59 and 74 are formed at both ends in a direction which is orthogonal to the protruding direction of a sensing part 21 with respect to a sealing member 40 in a portion sealed by the sealing...

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Bibliographische Detailangaben

1. Verfasser:	IWAKI TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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