PHYSICAL QUANTITY SENSOR AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To reduce a stress to be applied to a sensing part.SOLUTION: As a sensor chip 20, grooves 59 and 74 are formed at both ends in a direction which is orthogonal to the protruding direction of a sensing part 21 with respect to a sealing member 40 in a portion sealed by the sealing...

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Bibliographische Detailangaben
1. Verfasser:	IWAKI TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce a stress to be applied to a sensing part.SOLUTION: As a sensor chip 20, grooves 59 and 74 are formed at both ends in a direction which is orthogonal to the protruding direction of a sensing part 21 with respect to a sealing member 40 in a portion sealed by the sealing member 40, and relaxing members 60 and 77 whose Young's modulus is lower than that of the sealing member 40 are used for a region including the grooves 59 and 74. Thus, it is possible to reduce a stress to be applied from the sealing member 40 by the relaxing members 60 and 77, and to suppress the deterioration of detection accuracy.