HEAT SINK MADE OF COMPOSITE MATERIAL

PROBLEM TO BE SOLVED: To provide a heat sink made of a composite material that makes a thermal expansion coefficient of a heat sink using a composite material made by mixing a high thermal conductivity material and a low thermal expansion rigid material to be equal or close as much as possible to a...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHARA YOSHIHIRO, KUROKI HIRONORI, SAWAI NAOHISA
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat sink made of a composite material that makes a thermal expansion coefficient of a heat sink using a composite material made by mixing a high thermal conductivity material and a low thermal expansion rigid material to be equal or close as much as possible to a thermal expansion coefficient of a material constituting a housing or a substrate of a device which is a target for heat releasing, and that stably maintains the device which is a target for heat releasing by the heat sink.SOLUTION: A heat sink 1 for a device which is a target for heat releasing is configured by using a composite material made by determining a mixture ratio of a high thermal conductivity material and a low thermal expansion rigid material so as to be a material having a thermal expansion coefficient equal or close as much as possible to a thermal expansion coefficient of a material constituting a housing or a substrate of a device which is a target for heat releasing.