PROTECTIVE FILM FOR SEMICONDUCTOR WAFER AND PRODUCTION METHOD OF SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a protective film for a semiconductor wafer, which can give little warpage and high flexural strength of a semiconductor wafer and can reduce fluctuations of the flexural strength, and to provide a production method of a semiconductor chip with high productivity.SOLU...

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Bibliographische Detailangaben
1. Verfasser:	ICHIROKU NOBUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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