PROTECTIVE FILM FOR SEMICONDUCTOR WAFER AND PRODUCTION METHOD OF SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a protective film for a semiconductor wafer, which can give little warpage and high flexural strength of a semiconductor wafer and can reduce fluctuations of the flexural strength, and to provide a production method of a semiconductor chip with high productivity.SOLUTION: The protective film for a semiconductor wafer comprises a base film and a protective film formed thereon. The protective film comprises an adhesive layer and a reinforcing layer, in which the adhesive layer comprises the following (A) to (D) components and has a DSC peak temperature of 190°C or lower, and the reinforcing layer comprises the following (E) and (F) components and has a coefficient of linear expansion of 30 ppm or less. The components are: (A) 100 parts by mass of at least one resin selected from a group consisting of a phenoxy resin, a polyimide resin and a (meth)acryl resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 100 to 500 parts by mass of a filler excluding a mesh-like inorganic filler; (D) a catalytic amount of a catalyst for curing an epoxy resin; (E) 300 to 4000 parts by mass of a thermosetting resin; and (F) 300 to 4000 parts by mass of a mesh-like inorganic filler.