CURABLE COMPOSITION CONTAINING SILICA PARTICLES, CURED PRODUCT THEREOF, AND SEMICONDUCTOR SEALING MATERIAL USING THE SAME
PROBLEM TO BE SOLVED: To provide a semiconductor sealing material which exhibits excellent heat resistance and gas barrier properties, which can undergo potting at room temperature (20°C) and which does not suffer from degradation over long time under high temperature conditions at or above 150°C.SO...
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| creator | YAMANAKA KAZUHIRO EGUCHI HIROSHI MATSUNO TASUKU AKIYAMA KATSUHIRO |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor sealing material which exhibits excellent heat resistance and gas barrier properties, which can undergo potting at room temperature (20°C) and which does not suffer from degradation over long time under high temperature conditions at or above 150°C.SOLUTION: A curable composition contains a cage-like 8-membered cyclic siloxane compound (A) represented by the general formula (1), silica particles (C) and a metal compound (D). (In the formula, X represents a hydrogen atom (which may be partly substituted with fluorine), or a siloxane having an alkenyl group.) |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | CURABLE COMPOSITION CONTAINING SILICA PARTICLES, CURED PRODUCT THEREOF, AND SEMICONDUCTOR SEALING MATERIAL USING THE SAME |
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