CURABLE COMPOSITION CONTAINING SILICA PARTICLES, CURED PRODUCT THEREOF, AND SEMICONDUCTOR SEALING MATERIAL USING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor sealing material which exhibits excellent heat resistance and gas barrier properties, which can undergo potting at room temperature (20°C) and which does not suffer from degradation over long time under high temperature conditions at or above 150°C.SO...

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Hauptverfasser:	YAMANAKA KAZUHIRO, EGUCHI HIROSHI, MATSUNO TASUKU, AKIYAMA KATSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor sealing material which exhibits excellent heat resistance and gas barrier properties, which can undergo potting at room temperature (20°C) and which does not suffer from degradation over long time under high temperature conditions at or above 150°C.SOLUTION: A curable composition contains a cage-like 8-membered cyclic siloxane compound (A) represented by the general formula (1), silica particles (C) and a metal compound (D). (In the formula, X represents a hydrogen atom (which may be partly substituted with fluorine), or a siloxane having an alkenyl group.)