MOUNTING METHOD

PROBLEM TO BE SOLVED: To enable mounting of a compound semiconductor element in a state of a small size and enabling speeding up without deteriorating characteristics.SOLUTION: A mounting method comprises: facing a mounting surface of a mounting substrate 101 and a mounting surface of an element 102...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIRATORI YUTA, KAYAO NORIHIDE, IDA MINORU, AKEYOSHI TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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