MOUNTING METHOD

PROBLEM TO BE SOLVED: To enable mounting of a compound semiconductor element in a state of a small size and enabling speeding up without deteriorating characteristics.SOLUTION: A mounting method comprises: facing a mounting surface of a mounting substrate 101 and a mounting surface of an element 102...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIRATORI YUTA, KAYAO NORIHIDE, IDA MINORU, AKEYOSHI TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable mounting of a compound semiconductor element in a state of a small size and enabling speeding up without deteriorating characteristics.SOLUTION: A mounting method comprises: facing a mounting surface of a mounting substrate 101 and a mounting surface of an element 102 to make a bonding surface 103a of a bump 103 and a bonding surface 113a of an electrode pad 113 face each other and make a bonding surface 104a of a bump 104 and a bonding surface 114a of an electrode pad 114 face each other; and butting the bonding surface 103a of the bump 103 and the bonding surface 113a of the electrode pad 113 and butting the bonding surface 104a of the bump 104 and the bonding surface 114a of the electrode pad 114, and applying a load to between the mounting substrate 101 and the element 102 and performing heating to about 150°C in this state.