TRANSFER MOLDING METHOD, AND TRANSFER MOLDING APPARATUS

PROBLEM TO BE SOLVED: To suppress energy loss, to perform transfer molding in a short period of time, and to improve durability of an apparatus.SOLUTION: A transfer molding process performing transfer molding of a resin made sheet 25 held between a first mold 9 and a second mold 10 that are arranged...

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Bibliographische Detailangaben
Hauptverfasser: TAKEMURA KOICHI, SUZUKI KENJI, TAGUCHI YOSHITOSHI, KOJIMA MASAYUKI, KANEKO KAZUTAKA, SHIBATA TOMOHIDE, YAMANAKA YOSHIHISA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To suppress energy loss, to perform transfer molding in a short period of time, and to improve durability of an apparatus.SOLUTION: A transfer molding process performing transfer molding of a resin made sheet 25 held between a first mold 9 and a second mold 10 that are arranged to be opposed to each other by heating at least one of the molds, and a cooling process for cooling the resin made sheet 25, are performed. The cooling process is performed by a first cooling process for cooling the resin made sheet 25 in a state where pressurization at a first set value smaller than pressurization force at the transfer molding process is maintained, and by a second cooling process for cooling the resin made sheet 25 in a state where pressure is removed to a second set value smaller than the first set value.