POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS
PROBLEM TO BE SOLVED: To provide methods for cleaning substrates having copper and dielectric damascene metallization, in which a corrosion-prone surface of the copper has a cap composed of cobalt, cobalt alloy, nickel, nickel alloy, or cobalt-nickel alloy film, or an electronic device surface with...
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| creator | ARTUR KOLICS LI SHIJIAN TIRUCHIRAPALLI ARUNAGIRI WILLIAM THIE |
| description | PROBLEM TO BE SOLVED: To provide methods for cleaning substrates having copper and dielectric damascene metallization, in which a corrosion-prone surface of the copper has a cap composed of cobalt, cobalt alloy, nickel, nickel alloy, or cobalt-nickel alloy film, or an electronic device surface with a nonuniform composition distribution having different corrosion rates, is cleaned while avoiding deterioration in the device surface quality and a film thickness of about 20 nm.SOLUTION: Methods for cleaning substrates comprises a step of applying a cleaning solution to a substrate to remove at least one of defects and contamination with negligible dissolution of a cap, the solution comprising one or more amines, at least one of the one or more amines providing a pH from 7 to 13 in the cleaning solution. One embodiment of the present invention is a method of fabricating an integrated circuit. |
| format | Patent |
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One embodiment of the present invention is a method of fabricating an integrated circuit.</description><language>eng</language><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES ; BASIC ELECTRIC ELEMENTS ; CANDLES ; CHEMISTRY ; DETERGENT COMPOSITIONS ; DETERGENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FATTY ACIDS THEREFROM ; METALLURGY ; RECOVERY OF GLYCEROL ; RESIN SOAPS ; SEMICONDUCTOR DEVICES ; SOAP OR SOAP-MAKING ; USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140515&DB=EPODOC&CC=JP&NR=2014088569A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140515&DB=EPODOC&CC=JP&NR=2014088569A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARTUR KOLICS</creatorcontrib><creatorcontrib>LI SHIJIAN</creatorcontrib><creatorcontrib>TIRUCHIRAPALLI ARUNAGIRI</creatorcontrib><creatorcontrib>WILLIAM THIE</creatorcontrib><title>POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS</title><description>PROBLEM TO BE SOLVED: To provide methods for cleaning substrates having copper and dielectric damascene metallization, in which a corrosion-prone surface of the copper has a cap composed of cobalt, cobalt alloy, nickel, nickel alloy, or cobalt-nickel alloy film, or an electronic device surface with a nonuniform composition distribution having different corrosion rates, is cleaned while avoiding deterioration in the device surface quality and a film thickness of about 20 nm.SOLUTION: Methods for cleaning substrates comprises a step of applying a cleaning solution to a substrate to remove at least one of defects and contamination with negligible dissolution of a cap, the solution comprising one or more amines, at least one of the one or more amines providing a pH from 7 to 13 in the cleaning solution. One embodiment of the present invention is a method of fabricating an integrated circuit.</description><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CANDLES</subject><subject>CHEMISTRY</subject><subject>DETERGENT COMPOSITIONS</subject><subject>DETERGENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FATTY ACIDS THEREFROM</subject><subject>METALLURGY</subject><subject>RECOVERY OF GLYCEROL</subject><subject>RESIN SOAPS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOAP OR SOAP-MAKING</subject><subject>USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgI8A8O0XVxBVKeIZ7-fgrOPq6Ofp5-7gq-riEe_i7BCo5-Lgpu_kG-oT6OIAXBII5CcKhTcEiQY4hrsEK4Z4iHgrNjgIKPY6RrUDAPA2taYk5xKi-U5mZQcnMNcfbQTS3Ij08tLkhMTs1LLYn3CjAyMDQxsLAwNbN0NCZKEQAHxy_0</recordid><startdate>20140515</startdate><enddate>20140515</enddate><creator>ARTUR KOLICS</creator><creator>LI SHIJIAN</creator><creator>TIRUCHIRAPALLI ARUNAGIRI</creator><creator>WILLIAM THIE</creator><scope>EVB</scope></search><sort><creationdate>20140515</creationdate><title>POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS</title><author>ARTUR KOLICS ; LI SHIJIAN ; TIRUCHIRAPALLI ARUNAGIRI ; WILLIAM THIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014088569A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CANDLES</topic><topic>CHEMISTRY</topic><topic>DETERGENT COMPOSITIONS</topic><topic>DETERGENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FATTY ACIDS THEREFROM</topic><topic>METALLURGY</topic><topic>RECOVERY OF GLYCEROL</topic><topic>RESIN SOAPS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOAP OR SOAP-MAKING</topic><topic>USE OF SINGLE SUBSTANCES AS DETERGENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>ARTUR KOLICS</creatorcontrib><creatorcontrib>LI SHIJIAN</creatorcontrib><creatorcontrib>TIRUCHIRAPALLI ARUNAGIRI</creatorcontrib><creatorcontrib>WILLIAM THIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARTUR KOLICS</au><au>LI SHIJIAN</au><au>TIRUCHIRAPALLI ARUNAGIRI</au><au>WILLIAM THIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS</title><date>2014-05-15</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide methods for cleaning substrates having copper and dielectric damascene metallization, in which a corrosion-prone surface of the copper has a cap composed of cobalt, cobalt alloy, nickel, nickel alloy, or cobalt-nickel alloy film, or an electronic device surface with a nonuniform composition distribution having different corrosion rates, is cleaned while avoiding deterioration in the device surface quality and a film thickness of about 20 nm.SOLUTION: Methods for cleaning substrates comprises a step of applying a cleaning solution to a substrate to remove at least one of defects and contamination with negligible dissolution of a cap, the solution comprising one or more amines, at least one of the one or more amines providing a pH from 7 to 13 in the cleaning solution. One embodiment of the present invention is a method of fabricating an integrated circuit.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS |
| title | POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS |
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