POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS

PROBLEM TO BE SOLVED: To provide methods for cleaning substrates having copper and dielectric damascene metallization, in which a corrosion-prone surface of the copper has a cap composed of cobalt, cobalt alloy, nickel, nickel alloy, or cobalt-nickel alloy film, or an electronic device surface with...

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Bibliographische Detailangaben
Hauptverfasser:	ARTUR KOLICS, LI SHIJIAN, TIRUCHIRAPALLI ARUNAGIRI, WILLIAM THIE
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide methods for cleaning substrates having copper and dielectric damascene metallization, in which a corrosion-prone surface of the copper has a cap composed of cobalt, cobalt alloy, nickel, nickel alloy, or cobalt-nickel alloy film, or an electronic device surface with a nonuniform composition distribution having different corrosion rates, is cleaned while avoiding deterioration in the device surface quality and a film thickness of about 20 nm.SOLUTION: Methods for cleaning substrates comprises a step of applying a cleaning solution to a substrate to remove at least one of defects and contamination with negligible dissolution of a cap, the solution comprising one or more amines, at least one of the one or more amines providing a pH from 7 to 13 in the cleaning solution. One embodiment of the present invention is a method of fabricating an integrated circuit.