WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a wiring board which has excellent connection reliability by increasing a contact area between a through conductor and a wiring conductor layer.SOLUTION: In a wiring board 10 for electronic component inspection, a through hole 26 continuously penetrating a wiring con...

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Hauptverfasser:	HIRANO SATOSHI, NAGAYA YOSHIAKI, IMANISHI YUTAKA, IWATA MUNEYUKI, MORI NAOKO, MIYAMOTO TAKU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board which has excellent connection reliability by increasing a contact area between a through conductor and a wiring conductor layer.SOLUTION: In a wiring board 10 for electronic component inspection, a through hole 26 continuously penetrating a wiring conductor layer 23 and resin insulating layers 21 and 22 is formed. A via conductor 27 connected to the wiring conductor layer 23 is formed in the through hole 26. The through hole 26 has, at a part penetrating the wiring conductor layer 23, a first portion 51 which is located on the surface side of the resin insulating layers 21 and 22 and is formed by an inner wall surface of the wiring conductor layer 23, and a second portion 52 which is provided at a position farther away from the surface of the resin insulating layers 21 and 22 than the first portion 51 and is formed so that the inner wall surface of the wiring conductor layer 23 is narrowed relative to the first portion 51.